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US Patent 7841863 Spring interconnect structures

Patent 7841863 was granted and assigned to FormFactor on November, 2010 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

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Current Assignee

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Date Filed

June 30, 2009

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Date of Patent

November 30, 2010

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Patent Application Number

12495405

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Patent Citations Received

US Patent 11906549 Compliant pin probes with flat extension springs, methods for making, and methods for using

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US Patent 11867721 Probes with multiple springs, methods for making, and methods for using

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US Patent 11973301 Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making

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US Patent 11768227 Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers

US Patent 11774467 Method of in situ modulation of structural material properties and/or template shape

US Patent 11802891 Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using

US Patent 11761982 Probes with planar unbiased spring elements for electronic component contact and methods for making such probes

Patent Inventor Names

Gaetan L. Mathieu

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Benjamin N. Eldridge

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Gary W. Grube

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Richard A. Larder

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

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Patent Primary Examiner

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