US Patent 7835794 Electronics package suitable for implantation

The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by applying conductive adhesive between electrical contacts and non-conductive underfill around the contacts. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.