US Patent 7834277 Printed circuit board manufacturing method and printed circuit board
All edits
Edits on 31 Oct, 2023
Golden AI
Edits made to:
Article (+708 characters)
Article
Patent abstract
The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed circuit board 10 according to the present invention includes a step of selectively forming a plating layer 16 for lands 22a and 22b on a metal foil 14 on the printed circuit board 10, a step of adjusting the thickness of the plating layer 16, and a step of forming the metal foil 14 into lines 14a. The aspect ratio of via holes 28 formed on lands 22a and 22b can be adjusted by adjusting the thickness of the lands 22a and 22b.
Edits on 27 Sep, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 20 Sep, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 21 Jul, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 18 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07834277 Printed circuit board manufacturing method and printed circuit board US Patent 7834277 Printed circuit board manufacturing method and printed circuit board
Infobox
Patent Number
0783427700
Patent Number
783427700
Edits on 24 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
078342770
Date of Patent
November 16, 2010
0Patent Application Number
118625450
Date Filed
September 27, 2007
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
078342770
Date of Patent
November 16, 2010
0Patent Application Number
118625450
Date Filed
September 27, 2007
0Official Website
Patent Primary Examiner
Edits on 3 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 6 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07834277 Printed circuit board manufacturing method and printed circuit board
Infobox
Is a
Patent jurisdiction
Patent number
07834277
Date of patent
November 16, 2010
Patent application number
11862545
Date Filed
September 27, 2007
Patent primary examiner
Find more entities like US Patent 7834277 Printed circuit board manufacturing method and printed circuit board
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.