Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 16, 2010
Patent Application Number
11480824
Date Filed
July 6, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
A multilayer printed wiring board comprises a plurality of insulating layers which is about 100 μm or less in thickness and a plurality of conductor circuits formed on the insulating layers. Each of a plurality of viaholes electrically connecting conductor circuits on the insulating layers to each other is formed tapered inwardly from the surface of the insulating layer and the viaholes are disposed opposite to each other to form a multistage stacked vias.
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