Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 16, 2010
Patent Application Number
11970541
Date Filed
January 8, 2008
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of the thermocouple to the ceramic substrate. In one form, the junction is directly bonded using an active brazing material.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
