US Patent 7830667 Flexible wiring substrate and method for producing the same

Patent 7830667 was granted and assigned to Mitsui on November, 2010 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Mitsui

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

78306670

Patent Inventor Names

Hiroaki Kurihara0

Date of Patent

November 9, 2010

Patent Application Number

120390730

Date Filed

February 28, 2008

Patent Primary Examiner

‌

Jinhee J. Lee

Patent abstract

Disclosed is a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. A method for producing the flexible wiring substrate is also disclosed.