US Patent 7829995 Semiconductor device and method of fabrication
Patent 7829995 was granted and assigned to Panasonic on November, 2010 by the United States Patent and Trademark Office.
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A semiconductor device includes a first die pad, a first semiconductor chip provided on the first die pad, a second die pad, a second semiconductor chip provided on the second die pad, and a sealing resin made of a first resin material, sealing the first die pad, the first semiconductor chip, the second die pad and the second semiconductor chip. A lower surface of the first semiconductor chip is connected to the first die pad. A first portion of a lower surface of the second semiconductor chip is connected to the second die pad, and a second portion not connected to the second die pad of the lower surface of the second semiconductor chip is connected to an upper surface of the first semiconductor chip via a second resin material different from the first resin material.
US Patent 07829995 Semiconductor device and method of fabrication US Patent 7829995 Semiconductor device and method of fabrication
US Patent 07829995 Semiconductor device and method of fabrication
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