US Patent 7829852 Device having etched feature with shrinkage carryover
Patent 7829852 was granted and assigned to Intel on November, 2010 by the United States Patent and Trademark Office.
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In an embodiment of the present invention, a device includes a first etched feature located in a critical dimension scanning electron microscope (CD-SEM) characterization location, the first etched feature having an upper section, a middle section, and a lower section wherein the middle section is severely shrunk relative to a corresponding middle section of a second etched feature having similar dimensions and composition that is not located in a CD-SEM characterization location. In another embodiment of the present invention, the middle section of the first etched feature has a shrinkage carryover exceeding a threshold. In still another embodiment of the present invention, the middle section of the first etched feature exhibits a line edge roughness.
US Patent 07829852 Device having etched feature with shrinkage carryover US Patent 7829852 Device having etched feature with shrinkage carryover
US Patent 07829852 Device having etched feature with shrinkage carryover
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