Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 2, 2010
Patent Application Number
12078196
Date Filed
March 27, 2008
Patent Primary Examiner
Patent abstract
In fabrication of a semiconductor device mounted on a wiring board, a semiconductor circuit portion is formed over a glass substrate. Then, an interposer having connection terminals are bonded to the semiconductor circuit portion. After that, the glass substrate is peeled off from the semiconductor circuit portion, and a mold resin is poured to cover the periphery of the semiconductor circuit portion from a direction of the separation plane. Then, the mold resin is heated under predetermined conditions to be hardened.
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