Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wae Chet Yong0
Juergen Schredl0
Mario Feldvoss0
Teck Sim Lee0
Erich Griebl0
Date of Patent
October 26, 2010
Patent Application Number
12035972
Date Filed
February 22, 2008
Patent Primary Examiner
Patent abstract
A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first end of the resin, wherein the thickness of the heat sink is no greater than 35% of the thickness of the device.
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