Patent attributes
A wired circuit board is provided having a reinforced part thickened to ensure a high rigidity when it is used, while having the reinforced part thinned for easy handling when it is not yet used to prevent a cost increase and a productivity reduction. When the wired circuit board is used, a folding portion is valley-folded to laminate a reinforcing portion on a second connecting portion to contact the back surface of a fourth reinforcing plate of the reinforcing portion with the back surface of a second reinforcing plate of the second connecting portion. This achieves to reinforce the second connecting portion with the second reinforcing plate and the reinforcing portion and ensure a high rigidity by thickening the reinforced part. Since the reinforcing portion is supported in the same plane as a wired circuit portion via the folding portion before it is used, the reinforced part can be thinned and easy handling is achieved.
