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US Patent 7816303 Architecture for high temperature superconductor wire

Patent 7816303 was granted and assigned to American Superconductor Corporation on October, 2010 by the United States Patent and Trademark Office.

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Patent

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Current Assignee
American Superconductor Corporation
American Superconductor Corporation
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7816303
Date of Patent
October 19, 2010
Patent Application Number
11193262
Date Filed
July 29, 2005
Patent Citations Received
‌
US Patent 12027361 High temperature superconductor-based interconnect systems with a lowered thermal load for interconnecting cryogenic electronics with non-cryogenic electronics
0
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US Patent 11877521 Flexible multi-filament high temperature superconducting cable
0
Patent Primary Examiner
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Steven Bos
Patent abstract

A laminated superconductor wire includes a superconductor wire assembly, which includes a first superconductor insert comprising a first high temperature superconductor layer overlaying a first substrate and a second superconductor insert comprising a second high temperature superconductor layer overlaying a second substrate. The first and second superconductor inserts are joined together at their respective substrates. An electrically conductive structure substantially surrounds the superconductor wire assembly.

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