Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
October 12, 2010
Patent Application Number
12337347
Date Filed
December 17, 2008
Patent Primary Examiner
Patent abstract
According to one embodiment, an electronic package includes a semiconductor die, a heat sink and a metallization layer interposed between the semiconductor die and the heat sink. The metallization layer attaches the semiconductor die to the heat sink. The metallization layer has a thickness of about 5 μm or less and a thermal conductivity of about 60 W/m·K or greater.
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