Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 5, 2010
Patent Application Number
12465040
Date Filed
May 13, 2009
Patent Primary Examiner
Patent abstract
The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
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