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US Patent 7808101 3D smart power module

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
February 8, 2008
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Date of Patent
October 5, 2010
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Patent Application Number
12028051
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Patent Citations Received
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US Patent 12068298 High power density 3D semiconductor module packaging
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Patent Inventor Names
Tiburcio A. Maldo
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Yumin Liu
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Hua Yang
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Margie T. Rios
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Yong Liu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7808101
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Patent Primary Examiner
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Nitin Parekh
0

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