US Patent 7802970 Micropump for electronics cooling

Patent 7802970 was granted and assigned to Purdue Research Foundation on September, 2010 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Purdue Research Foundation

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

78029700

Patent Inventor Names

Suresh V. Garimella0

Vishal Singhal0

Date of Patent

September 28, 2010

Patent Application Number

114428340

Date Filed

May 30, 2006

Patent Primary Examiner

‌

Charles G Freay

Patent abstract

A micropump including one or more microchannels for receiving a fluid and a plurality of electrodes arranged on a diaphragm and energized in a manner to provide an enhanced electrohydrodynamic flow of fluid through the one or more microchannels. The micropump may be used for pumping a working fluid for removing heat from a heat-generating electronic component or for delivery of a drug, medicine, or other treatment agent as or in a fluid to a patient.