Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Koji Soejima0
Masaya Kawano0
Yoichiro Kurita0
Date of Patent
September 21, 2010
Patent Application Number
11491180
Date Filed
July 24, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of manufacturing according to an embodiment of the present invention includes forming a seed metal layer 20a on a supporting substrate 70, forming an interconnect layer 10 including an interconnect 18 on the seed metal layer 20a, removing the supporting substrate 70 after forming the interconnect layer 10, and patterning the seed metal layer 20a thus to form an interconnect 20 after removing the supporting substrate.
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