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US Patent 7799701 Method of coating substrate

Patent 7799701 was granted and assigned to Hitachi on September, 2010 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee
Hitachi
Hitachi
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7799701
Date of Patent
September 21, 2010
Patent Application Number
12153995
Date Filed
May 28, 2008
Patent Primary Examiner
‌
Charles D. Garber
Patent abstract

A method of coating by supplying a liquid material from a nozzle tip to form a film on a substrate surface facing to the nozzle, having the steps of: preparing a translation mechanism, which is capable of moving the nozzle in an in-plane direction and in a thickness direction of the substrate; making the nozzle to come gradually closer to the substrate, after positioning of the nozzle on the in-plane of the substrate, by using the translation mechanism; detecting electric current flowing through the nozzle from the substrate surface, when a semiconductor droplet supplied from the nozzle tip contacts with an electrode installed at the substrate surface; stopping accession of the nozzle to the substrate, when the electric current exceeds threshold value set in advance; and making the nozzle tip apart from the substrate farther than in the stopping, so as to coat the substrate with the liquid material.

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