US Patent 7799615 Power converter package and thermal management
Patent 7799615 was granted and assigned to VLT on September, 2010 by the United States Patent and Trademark Office.
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Power conversion apparatus can include a circuit board with power conversion circuitry and a package. The package may be formed by encapsulating areas of the circuit board assembly either before or after the interface contacts are attached to the circuit board. A method for encapsulating two sides of a substrate can include providing a mold that fills a larger first cavity to create a sealing force on a smaller second cavity. The encapsulant flows through the first cavity into the second cavity. A thermal extender can include a surface for mounting a heat dissipating power converter and a surface for mating with an external circuit board. Interface conductors may mate with contacts on the heat dissipating power converter and with conductive regions on the external circuit board. A heat sink may be thermally coupled to remove heat generated by the power converter.
US Patent 07799615 Power converter package and thermal management US Patent 7799615 Power converter package and thermal management
US Patent 07799615 Power converter package and thermal management
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