US Patent 7799608 Die stacking apparatus and method
Patent 7799608 was granted and assigned to Advanced Micro Devices on September, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 1, 2007
1
Date of Patent
September 21, 2010
1
Patent Application Number
11832519
1
Patent Inventor Names
Kevin O'Neil
1
Neil McLellan
1
Vincent Chan
1
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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