Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Gurtej S. Sandhu0
Chandra Mouli0
Date of Patent
September 14, 2010
0Patent Application Number
123563840
Date Filed
January 20, 2009
0Patent Primary Examiner
Patent abstract
The invention includes semiconductor packages having grooves within a semiconductor die backside; and includes semiconductor packages utilizing carbon nanostructures (such as, for example, carbon nanotubes) as thermally conductive interface materials. The invention also includes methods of cooling a semiconductor die in which coolant is forced through grooves in a backside of the die, and includes methods of making semiconductor packages.
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