An organic solderability preservative (OSP) composition comprising an alkyl cyclic alcohol and an azole compound having enhanced composition stability against crystallization of the azole compound.
US Patent 07794531 Organic solderability preservative comprising high boiling temperature alcoholUS Patent 7794531 Organic solderability preservative comprising high boiling temperature alcohol
Infobox
Patent Number
0779453100
Patent Number
779453100
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