US Patent 7791897 Multi-layer embedded capacitance and resistance substrate core

Patent 7791897 was granted and assigned to Endicott Interconnect Technologies, Inc. on September, 2010 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

‌

Endicott Interconnect Technologies, Inc.

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

77918970

Patent Inventor Names

Irving Memis0

Steven G. Rosser0

Rabindra N. Das0

John M. Lauffer0

Date of Patent

September 7, 2010

Patent Application Number

122831460

Date Filed

September 9, 2008

Patent Primary Examiner

‌

Xiaoliang Chen

Patent abstract

A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.

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