US Patent 7790510 Metal lid with improved adhesion to package substrate

Patent 7790510 was granted and assigned to Xilinx on September, 2010 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Xilinx

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

77905100

Patent Inventor Names

Leilei Zhang0

Date of Patent

September 7, 2010

Patent Application Number

119724280

Date Filed

January 10, 2008

Patent Primary Examiner

‌

Kevin M. Picardat

Patent abstract

A metal lid for packaging semiconductor chips is stamped to form a sloped sidewall with a set-back from the edge of a package substrate. After the metal lid is placed over the semiconductor chip, molding compound is formed around portions of the exposed perimeter of the package substrate and against the sloped sidewall of the lid. The molding compound securely attaches the lid to the package substrate, providing improved reliability to the lid-substrate joint. The lightweight lid also increases standoff when a solder ball-grid array is used to connect the packaged IC to a printed wiring board, improving the reliability of the ball-grid array connections.