US Patent 7790493 Wafer-level, polymer-based encapsulation for microstructure devices
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Disclosed herein is a method of fabricating a device having a microstructure. The method includes forming a connector on a semiconductor substrate, coating the connector with a polymer layer, and immersing the semiconductor substrate and the coated connector in an etchant solution to form the microstructure from the semiconductor substrate and to release the coated connector and the microstructure from the semiconductor substrate such that the microstructure remains coupled to a further element of the device via the coated connector. In some cases, the microstructure is defined by forming an etch stop in the semiconductor substrate, and the microstructure and the semiconductor substrate are coated with a polymer layer, which may then be selectively patterned. The microstructure may then be released from the semiconductor substrate in accordance with the etch stop.
US Patent 07790493 Wafer-level, polymer-based encapsulation for microstructure devices US Patent 7790493 Wafer-level, polymer-based encapsulation for microstructure devices
US Patent 07790493 Wafer-level, polymer-based encapsulation for microstructure devices
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