US Patent 7786570 Heat sink package
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Patent abstract
Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same.
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US Patent 07786570 Heat sink package US Patent 7786570 Heat sink package
Infobox
Patent Number
0778657000
Patent Number
778657000
Edits on 2 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077865700
Date of Patent
August 31, 2010
0Patent Application Number
123587580
Date Filed
January 23, 2009
0Official Website
Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077865700
Date of Patent
August 31, 2010
0Patent Application Number
123587580
Date Filed
January 23, 2009
0Official Website
Patent Primary Examiner
Edits on 3 Jun, 2022
Golden AI
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Edits on 5 Dec, 2021
Golden AI
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US Patent 07786570 Heat sink package
Infobox
Is a
Patent jurisdiction
Patent number
07786570
Date of patent
August 31, 2010
Patent application number
12358758
Date Filed
January 23, 2009
Patent primary examiner
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