Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Xiaohua H. Sun0
Ryan C. Tong0
Date of Patent
August 24, 2010
0Patent Application Number
115385530
Date Filed
October 4, 2006
0Patent Primary Examiner
Patent abstract
Disclosed is an attachment apparatus. The attachment apparatus may facilitate attachment of various components to a printed circuit board (PCB) including a thermal management component.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.