Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tomomi Murayama0
Kentaro Tomioka0
Date of Patent
August 24, 2010
0Patent Application Number
124299480
Date Filed
April 24, 2009
0Patent Primary Examiner
Patent abstract
According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
