US Patent 7782614 Heat dissipation module

An electronic device includes a first electronic component, a second electronic component adjacent to the first electronic component, a heat sink arranged on the first electronic component to absorb heat therefrom, an axial fan mounted on the heat sink for generating an airflow to the heat sink, and a guiding member. The axial fan includes a frame and an impeller received in the frame. A cutout is defined in the frame facing the second electronic component. The guiding member is arranged between the axial fan and the second electronic component for guiding a part of the airflow escaping from the frame via the cutout to the second electronic component.