Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 24, 2010
Patent Application Number
11783024
Date Filed
April 5, 2007
Patent Primary Examiner
Patent abstract
A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semi-conductive layer formed on the conductive pattern, an insulating cover layer formed on the first semi-conductive layer, and a second semi-conductive layer formed on the insulating cover layer. The first semi-conductive layer and the second semi-conductive layer are electrically connected to the metal supporting board.
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