Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 3, 2010
Patent Application Number
12484939
Date Filed
June 15, 2009
Patent Primary Examiner
Patent abstract
An adhesive sheet for laser dicing is used for dicing a workpiece into individual chips by light absorption ablation of laser beam and has at least an adhesive layer on one side of a base material which has a surface opposite to the adhesive layer having no convex parts of width (W) of 20 mm or less and height (h) of 1 μm or more, or no concave parts of width (W) of 20 mm or less and depth (d) of 1 μm or more.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
