Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 27, 2010
Patent Application Number
11853312
Date Filed
September 11, 2007
Patent Primary Examiner
Patent abstract
A semiconductor package and a method for manufacturing the same. The semiconductor package includes a substrate having connection pads formed on one surface thereof, a semiconductor chip having bonding pads formed on one surface thereof to correspond to the connection pads; bumps for electrically connecting the connection pads and the bonding pads with each other, a coating layer located on exposed surface portions of the bonding pads and the connection pads to prevent voids from being formed in spaces between the substrate and the semiconductor chip, and an underfill member filled in the spaces over the coating layer.
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