US Patent 7763970 Power module
Patent 7763970 was granted and assigned to Infineon Technologies on July, 2010 by the United States Patent and Trademark Office.
All edits
Edits on 31 Oct, 2023
Golden AI
Edits made to:
Article (+324 characters)
Article
Patent abstract
A power semiconductor module comprises a housing. The housing comprises a casing and at least one coating of high resistance to surface tracking. A plurality of electrical conductors is provided on the housing. The coating is provided on a creepage distance that is provided between the electrical conductors.
Edits on 18 Sep, 2023
Golden AI
Edits made to:
Infobox (+2 properties)
Infobox
Patent Inventor Names
Reinhold Spanke0
Roman Tschirbs0
Edits on 21 Jun, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 21 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07763970 Power module US Patent 7763970 Power module
Infobox
Patent Number
077639700
Patent Number
77639700
Edits on 29 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077639700
Date of Patent
July 27, 2010
0Patent Application Number
120383280
Date Filed
February 27, 2008
0Official Website
Patent Primary Examiner
Edits on 3 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 5 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07763970 Power module
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07763970
Date of patent
July 27, 2010
Patent application number
12038328
Date Filed
February 27, 2008
Patent primary examiner
Find more entities like US Patent 7763970 Power module
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.