Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kazuyuki Misumi0
Kazushi Hatauchi0
Yasuki Takata0
Naoya Yasuda0
Hideyuki Arakawa0
Katsuyuki Fukudome0
Date of Patent
July 27, 2010
0Patent Application Number
120733840
Date Filed
March 5, 2008
0Patent Primary Examiner
Patent abstract
A plurality of inner leads 14 are provided around a die pad 13. A grounded GND lead 16 is provided in a region between the die pad 13 and the plurality of inner leads 14. A semiconductor chip 17 and the plurality of inner leads 14 are connected to each other by a plurality of wires 21. The semiconductor chip 17 and the GND lead 16 are connected to each other by GND wires 22. The GND wires 22 are disposed between a plurality of wires 21. The distance between ends of each adjacent pair of the inner leads 14 is 0.2 mm or less.
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