US Patent 7763526 Wafer and wafer cutting and dividing method
Patent 7763526 was granted and assigned to Denso on July, 2010 by the United States Patent and Trademark Office.
All edits
Edits on 31 Oct, 2023
Golden AI
Edits made to:
Article (+454 characters)
Article
Patent abstract
A laser beam is applied to an interior of a wafer through a top surface to form modified areas in a plurality of layers of modified area groups. Intervals of the modified areas in one of the layers of modified area groups differ from intervals of the modified areas in another one of the layers of the modified area groups, which is closer to the top surface of the wafer in comparison to the one of the layers of the modified area groups.
Edits on 15 Jul, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07763526 Wafer and wafer cutting and dividing method US Patent 7763526 Wafer and wafer cutting and dividing method
Infobox
Patent Number
0776352600
Patent Number
776352600
Edits on 25 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 5 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077635260
Date of Patent
July 27, 2010
0Patent Application Number
115986510
Date Filed
November 14, 2006
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077635260
Date of Patent
July 27, 2010
0Patent Application Number
115986510
Date Filed
November 14, 2006
0Official Website
Patent Primary Examiner
Edits on 3 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 5 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07763526 Wafer and wafer cutting and dividing method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07763526
Date of patent
July 27, 2010
Patent application number
11598651
Date Filed
November 14, 2006
Patent primary examiner
Find more entities like US Patent 7763526 Wafer and wafer cutting and dividing method
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.