Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 27, 2010
Patent Application Number
11768730
Date Filed
June 26, 2007
Patent Primary Examiner
Patent abstract
An integrated circuit package system includes a die pad with leads; attaching an integrated circuit over the die pad; attaching a connector to the integrated circuit and the leads; and forming an encapsulant, over the integrated circuit, having a connection cavity over the leads leaving an exposed portion of the leads.
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