US Patent 7759777 Semiconductor module
Patent 7759777 was granted and assigned to Infineon Technologies on July, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second main surface and the carrier.
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Official Website
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US Patent 07759777 Semiconductor module US Patent 7759777 Semiconductor module
Infobox
Patent Number
0775977700
Patent Number
775977700
Edits on 27 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077597770
Date of Patent
July 20, 2010
0Patent Application Number
117357620
Date Filed
April 16, 2007
0Official Website
Patent Primary Examiner
Edits on 27 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077597770
Date of Patent
July 20, 2010
0Patent Application Number
117357620
Date Filed
April 16, 2007
0Official Website
Patent Primary Examiner
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US Patent 07759777 Semiconductor module
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07759777
Date of patent
July 20, 2010
Patent application number
11735762
Date Filed
April 16, 2007
Patent primary examiner
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