Patent attributes
A method for preparing a protective layer (38) on a surface of the substrate (36) that requires a bonding temperature (BT) above a detrimental phase transformation temperature range (28) of the substrate, and then cooling the layer and substrate without cracking the layer or detrimentally transforming the substrate. The protective layer (38) and the substrate (36) are cooled from the bonding temperature (BT) to a temperature (46) above the detrimental phase transformation range (28) at a first cooling rate (30) slow enough to avoid cracking the protective layer. Next, the protective layer and the substrate are cooled to a temperature below the detrimental phase transformation range of the substrate at a second cooling rate (27) fast enough to pass the detrimental phase transformation range before a substantial transformation of the substrate into the detrimental phase can occur.
