Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 20, 2010
Patent Application Number
11046364
Date Filed
January 27, 2005
Patent Primary Examiner
Patent abstract
An electrical device includes an interconnect and a pair substrates at least one of which includes an integrated circuit, the pair of substrates being bonded together by a bond that includes a structure having multiple widths and a composition that is selected from the group consisting of a graded material and a first material upon a second material.
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