US Patent 7755901 Heat dissipating structure for light emitting diodes

Patent 7755901 was granted and assigned to Asia Vital Components Co., Ltd. on July, 2010 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Asia Vital Components Co., Ltd.

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

77559010

Patent Inventor Names

Ching-Hang Shen0

Date of Patent

July 13, 2010

Patent Application Number

119709280

Date Filed

January 8, 2008

Patent Primary Examiner

‌

Michael V. Datskovskiy

Patent abstract

A heat dissipating structure associated with light emitting diodes includes a circuit substrate, a guide heat component, a heat dissipating device. The circuit substrate is attached with light emitting diodes. The guide heat component has a first end contacting the circuit substrate and a second end contacting with fins, which are provided with the heat dissipating device. The heat generated by the light emitting diodes is transmitted to the heat dissipating device via the guide heat pipe and then dissipated outward via the heat dissipating device.