Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 13, 2010
Patent Application Number
11751350
Date Filed
May 21, 2007
Patent Primary Examiner
Patent abstract
A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing.
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