Patent attributes
A heat dissipation device includes a base adapted for absorbing heat from an electronic device, a heat spreader located above the base, a first fin assembly including a plurality of fins arranged between the base and the heat spreader, and a heat pipe thermally contacting with the base and the heat spreader. A channel is defined between every two adjacent fins. Each of the fins extends along a front-to-rear direction. The heat pipe includes an evaporating portion thermally contacting with the base, a condensing portion thermally contacting with the heat spreader, and a connecting portion interconnecting the evaporating portion and the condensing portion. The evaporating portion and condensing portion of the heat pipe are parallel to the fins, and the connecting portion of the heat pipe is located at a rear side of the first fin assembly.
