US Patent 7745935 Method to create super secondary grain growth in narrow trenches

Patent 7745935 was granted and assigned to IMEC on June, 2010 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

IMEC

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

77459350

Patent Inventor Names

Sywert H. Brongersma0

Gerald Beyer0

Date of Patent

June 29, 2010

Patent Application Number

122527640

Date Filed

October 16, 2008

Patent Primary Examiner

‌

Thao P. Le

Patent abstract

The present invention relates to a method for obtaining enlarged Cu grains in small trenches. More specifically it related to a method for creating enlarged copper grains or inducing super secondary grain growth in electrochemically deposited copper in narrow trenches and/or vias to be used in semiconductor devices.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 7745935 Method to create super secondary grain growth in narrow trenches

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API