US Patent 7745256 Rectangular-shaped controlled collapse chip connection

A rectangular-shaped controlled collapse chip connection (C4) is described. In one embodiment, there is a semiconductor chip package that comprises a semiconductor chip package substrate and a semiconductor chip having a plurality of rectangular-shaped C4 contacts attached thereto that connect the semiconductor chip to the semiconductor chip package substrate. The plurality of rectangular-shaped C4 contacts are arranged along a surface of the semiconductor chip in an orientation that extends radially from a center of the surface of the semiconductor chip.