Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chiharu Takasaki0
Date of Patent
June 22, 2010
0Patent Application Number
118094780
Date Filed
June 1, 2007
0Patent Primary Examiner
Patent abstract
The present invention provides a method for manufacturing a semiconductor device, including the step of forming a hole penetrating an insulating film over a semiconductor substrate, wherein the step includes the steps of forming a pedestal at a position where a hole to be formed; forming an insulating film to bury the pedestal; forming a first hole in the insulating film so as to expose a top surface of the pedestal; and removing the pedestal to form a second hole continuous with the first hole to form a hole penetrating the insulating film.
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