US Patent 7741153 Modular chip integration techniques

Modular chip integration and operation techniques are provided. In one aspect, a method of integrating chips, chip macros or at least one chip in combination with at least one chip macro is provided. The method comprises the following steps. The chips, chip macros or at least one chip in combination with at least one chip macro are assembled on a single carrier platform. One or more signal inputs and outputs are provided to each of the chips, chip macros or at least one chip in combination with at least one chip macro. One or more power and ground inputs and outputs are provided to each of the chips, chip macros or at least one chip in combination with at least one chip macro. The power and ground inputs and outputs to one or more of the chips, chip macros or at least one chip in combination with at least one chip macro are segmented from the power and ground inputs and outputs to at least one other of the chips, chip macros or at least one chip in combination with at least one chip macro so as to form a plurality of voltage islands.