Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 15, 2010
Patent Application Number
11353564
Date Filed
February 13, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
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