Patent 7737537 was granted and assigned to Infineon Technologies on June, 2010 by the United States Patent and Trademark Office.
Embodiments provide an electronic device. The electronic device includes a leadframe having a first face that defines an island and multiple leads configured to communicate with a chip attached to the island, a first structure element separate from and coupled to a first face of the leadframe, at least one electrical connector coupled between the chip and the first structure element, and at least one electrical connector coupled between the first structure element and one of the multiple leads.