Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Visit Thaveeprungsriporn0
Yasunari Ooyabu0
Jun Ishii0
Date of Patent
June 15, 2010
0Patent Application Number
118127970
Date Filed
June 21, 2007
0Patent Primary Examiner
Patent abstract
A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.
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