Patent attributes
A molded product of a wholly aromatic liquid crystal polyester resin composition having a dielectric constant of 3.0 or less and a dielectric dissipation factor of 0.04 or less and is obtained by an injection molding of a composition comprising 90 to 45 percent by weight of the wholly aromatic liquid crystal polyester having a melting point of 320C or more, 10 to 40 percent by weight of an inorganic spherical hollow material having an aspect ratio of 2 or less, and 0 to 15 percent by weight of an inorganic filler having an aspect ratio of 4 or more. The molded product has dielectric properties suitable for information and telecommunications equipment, and is excellent in solder heat resistance, processability, and dimensional stability. The molded product is advantageous as a substrate material for use in information and telecommunications equipment such as a cellular mobile phone and as a fixing/holding member of a transmitter-receiver element.
